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RoHS Compliant Ultra Soft Memory Modules 2W 2.35 G/Cc Thermal Conductive Gap Filler 35 Shore00 TIF130-20-11E

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RoHS Compliant Ultra Soft Memory Modules 2W 2.35 G/Cc Thermal Conductive Gap Filler 35 Shore00 TIF130-20-11E

Brand Name : ZIITEK

Model Number : TIF130-20-11E

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 days

Packaging Details : 1000pcs/bag

Thermal conductivity : 3.0W/m-K

Hardness : 35 Shore 00

Specific Gravity : 2.35g/cc

Dielectric Constant : 5.5 MHz

Fire rating : 94-V0

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RoHS compliant ultra soft Memory Modules 2W thermal conductive gap filler 35 shore00 TIF130-20-11E

The TIF130-20-11E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

TIF100-20-11E Series Datasheet-(E)-REV01.pdf


Features:

> Good thermal conductive: 2.0W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF130-20-11E Series
Color

Gray

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
*** 10mils / 0.254 mm

0.48

20mils / 0.508 mm

0.56

Specific Gravity

2.35 g/cc

ASTM D297

30mils / 0.762 mm

0.71

40mils / 1.016 mm

0.80

Thickness range

0.010”-0.200”

ASTM D374

50mils / 1.270 mm

0.91

60mils / 1.524 mm

0.94

Hardness
35 Shore 00 ASTM 2240

70mils / 1.778 mm

1.05

80mils / 2.032 mm

1.15

Outgassing(TML)

0.30%

ASTM E595

90mils / 2.286 mm

1.25

100mils / 2.540 mm

1.34

Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

1.43

120mils / 3.048 mm

1.52

Dielectric Breakdown Voltage
>5000 VAC ASTM D149

130mils / 3.302mm

1.63

140mils / 3.556 mm

1.71

Dielectric Constant
5.5 MHz ASTM D150

150mils / 3.810 mm

1.81

160mils / 4.064 mm

1.89
Volume Resistivity
5.3X10" Ohm-meter ASTM D257

170mils / 4.318 mm

1.98

180mils / 4.572 mm

2.07

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

2.14

200mils / 5.080 mm

2.22

Thermal conductivity
2.0 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
RoHS Compliant Ultra Soft Memory Modules 2W 2.35 G/Cc Thermal Conductive Gap Filler 35 Shore00 TIF130-20-11E

Product Tags:

heatsink thermal pad

      

thermal conductive pad

      

Ultra Soft Thermal Conductive Gap Filler

      
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