Home > Thermal Insulation Materials >

0.018"/0.457mm Thickness Thermal Insulation Materials In Power Semiconductors

Product Categories

Phase Changing Materials [37]
Thermal Conductive Pad [155]
Thermal Gap Filler [189]
Thermal Conductive Grease [27]
Thermal Insulation Materials [33]
Thermal Graphite Sheet [53]
Thermal Adhesive Tape [47]
Thermal Conductive Glue [15]
Thermal Conductive Adhesive [13]
Thermal Conductive Plastic [23]
Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [22]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [13]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

0.018"/0.457mm Thickness Thermal Insulation Materials In Power Semiconductors

Name: 0018quot0457mm Thickness Thermal Insulation Materials In Power Semiconductors
Brand: Ziitek
Price: 1 USD

Best 0.018"/0.457mm Thickness Thermal Insulation Materials In Power Semiconductors wholesale

Brand Name : Ziitek

Model Number : TIS818

Certification : RoHs and UL

Place of Origin : China

MOQ : 1000PCS

Supply Ability : 100000PCS/Day

Delivery Time : 2-3Word days

Packaging Details : 1000pcs/bag

Color : Grey

The thickness of the : 0.018"/0.457mm

Tensile strength : >600 psi

The breakdown voltage : >5000 VAC

Thermal conductivity : 1.6W/mK

Fire rating : 94-V0

Contact Now

Thermal Insulation Materials in Power semiconductors:To packages, MOSFETs & IGBTs

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

The TIS™818Series products are the high-efficiency insulation ones with thermal conduction properties. The supplement of the insulation base film made by silica gel into the heat-conduction material creates a great effect on both the insulation and heat conduction.

Features

> Highly compliant surface characteristic with high thermal conductivity
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures

Applications

> Power conversion equipment
> Power semiconductors:To packages, MOSFETs & IGBTs
> Audio and Video components
> Automotive control units
> Motor controllers
> General high pressure interface

Typical Properties of TIS™818 Series
Product Name	TIS^TM806	TIS^TM808	TIS^TM810	TIS^TM812	TIS^TM818	Test Method
Color	Gray	Gray	Gray	Gray	Gray	Visual
Construction & Compostion	Ceramic filled silicone rubber					***
Composite Thickness	0.006"/0.152 mm	0.008"/0.203mm	0.010"/0.254mm	0.012"/0.304mm	0.018"/0.457mm	ASTM D751
Specific Gravity	2.2 g/cc					ASTM D297
Heat Capacity	1 l/g-K					ASTM C351
Hardness	50 Shore A					ASTM 2240
Tensile Strength	450 psi	>600 psi	>600 psi	>600 psi	>600 psi	ASTM D412
Continuos Use Temp	(-58 to 356℉) / (-50 to 180℃)					***
Electrical
Dielectric Breakdown Voltage	>1500 VAC	>3500 VAC	>5000 VAC	>5000 VAC	>5000 VAC	ASTM D149
Dielectric Constant	5.5 MHz					ASTM D150
Volume Resistivity	5.0X10" Ohm-meter					ASTM D257
Fire rating	94 V0					equivalent UL
Thermal
Thermal conductivity	1.6 W/m-K					ASTM D5470
Thermal Impedance @50psi	0.21℃-in²/W	0.35℃-in²/W	0.82℃-in²/W	1.23℃-in²/W	1.83℃-in²/W	ASTM D5471

Standard Thicknesses:

0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.009"(0.228mm)
0.010"(0.254mm) 0.012"(0.304mm) 0.018"(0.457mm)
Consult the factory alternate thickness.

Standard Sizes:

16" x 18"(406mm x 457mm) 16" x 200'(406mm x 60.9M)
Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on doule side with "A2" suffix.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Reinforcement:
TIS™ series sheets are fiberglass reinforced.

Product Tags:

0.018"/0.457mm Thickness Thermal Insulation Materials In Power Semiconductors Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

0.018"/0.457mm Thickness Thermal Insulation Materials In Power Semiconductors

0.018"/0.457mm Thickness Thermal Insulation Materials In Power Semiconductors

heat insulation materials

thermal insulator materials

0.457mm Thermal Insulation Materials

0.018"/0.457mm Thickness Thermal Insulation Materials In Power Semiconductors Images